Nov 6 (Reuters) – Taiwan Semiconductor Manufacturing Co is considering expanding into advanced memory chip production, in a move that would allow it to capture a larger share of the AI hardware market, The Information reported on Friday.
The company recently started charting plans for making a type of advanced memory chips called 3D DRAM at the request of Nvidia, its biggest customer, the report said, citing two people with direct knowledge of the matter.
TSMC and Nvidia did not immediately respond to Reuters’ requests for comment.
• TSMC could opt to build new factories for advanced memory chips, but it was not clear when it plans to begin production, according to the report
• The world’s largest chip manufacturer is also exploring acquiring an existing plant and converting it for memory production, the report said, similar to Micron’s move this year to buy a fab and convert it for DRAM output
• DRAM, or dynamic random access memory, chips are used to store data temporarily in devices. 3D DRAM is a memory architecture that stacks memory cells vertically rather than in a single horizontal layer to boost capacity
• The push is helmed by Hsu Kuo-chin, a vice president who oversees advanced packaging at TSMC, according to the report
• TSMC’s potential move comes at a time when a severe, AI-driven shortage of memory chips has pushed up prices and sent chip designers scrambling to look for additional supply
• If TSMC pushes into advanced memory, it will have to compete with companies such as Samsung Electronics, SK Hynix and Micron
(Reporting by Deborah Sophia in Bengaluru; Editing by Shilpi Majumdar)
